Peter,
Looking great thus far - learning curves are a sod.
Re previous comments on thief rings etc.
You want to have a uniform current (amperes per square inch) all over by provision of anodes and "thief" cathodes. Alas practice is invariably a compromise on theory (AKA just not possible.).
If you have areas that exceed the maximum rate, you may just produce mud, get too low and you may just produce nodules - or vice versa - confounding variables.
Moving the parts about in solution (as done for through hole PCB plating) or rotation (with obvious commutating problems - solved by just rotating backwards and forwards) or simply moving the solution about via a pump or impellor. Relative motion also helps increase deposition rates by clearing the diffusion layer away from the cathode. (A'la YRPS - Yamaha Rapid Plating System which typically deposits Nickle and Chrome at very high rates.)
Regards, Ken
Looking great thus far - learning curves are a sod.
Re previous comments on thief rings etc.
You want to have a uniform current (amperes per square inch) all over by provision of anodes and "thief" cathodes. Alas practice is invariably a compromise on theory (AKA just not possible.).
If you have areas that exceed the maximum rate, you may just produce mud, get too low and you may just produce nodules - or vice versa - confounding variables.
Moving the parts about in solution (as done for through hole PCB plating) or rotation (with obvious commutating problems - solved by just rotating backwards and forwards) or simply moving the solution about via a pump or impellor. Relative motion also helps increase deposition rates by clearing the diffusion layer away from the cathode. (A'la YRPS - Yamaha Rapid Plating System which typically deposits Nickle and Chrome at very high rates.)
Regards, Ken
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