I smear the flux on anything I expect to get braze, even if I think the flux will be removed when assembling. The are different "thicknesses" of silver solder - thin (easy flow) and gap fill (thick), the gaps needed for the thin stuff are a lot less. When you have a gap you can make it stay in assembly using a center punch to upset material - if used on a rod end in a hole it's maintain the gap you need all around while keeping it centered. I like to use one of the automatic center punches for that, keeps the punch size (and thus the upset height) even.